Organic light-emitting display device

ABSTRACT

An organic light-emitting display device, including a substrate that includes a plurality of first emission portions that realize a first color and a plurality of second emission portions that realize a second color; a pixel-defining film that defines the plurality of first emission portions and the plurality of second emission portions; a plurality of pixel electrodes that are separate from each other and respectively correspond to the plurality of first emission portions; and a first stacked structure that includes an intermediate layer and a counter electrode on the intermediate layer, the intermediate layer including an organic emission layer emitting light of the first color, the first stacked structure further including first emission pattern portions respectively corresponding to the plurality of first emission portions, and first connection pattern portions on the pixel-defining film, the first connection pattern portions connecting the first emission pattern portions.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation application based on pending application Ser. No.15/839,307, filed Dec. 12, 2017, which in turn is a continuation ofapplication Ser. No. 14/838,390, filed Aug. 28, 2015, now U.S. Pat. No.9,859,344, issued Jan. 2, 2018, the entire contents of both of which ishereby incorporated by reference.

Korean Patent Application No. 10-2015-0025911, filed on Feb. 24, 2015,in the Korean Intellectual Property Office, and entitled: “OrganicLight-Emitting Display Device and Method of Manufacturing the Same,” isincorporated by reference herein in its entirety.

BACKGROUND 1. Field

One or more exemplary embodiments relate to an organic light-emittingdisplay device and a method of manufacturing the same.

2. Description of the Related Art

An organic light-emitting display device is a display device in whichpixels may each include an organic light-emitting diode (OLED). The OLEDmay include a pixel electrode, a counter electrode facing the pixelelectrode, and an emission layer disposed between the pixel electrodeand the counter electrode. In the organic light-emitting display device,the pixel electrodes may have island shapes patterned according to thepixels, and the counter electrode may be shaped such that the counterelectrode integrally covers the pixels.

SUMMARY

One or more exemplary embodiments may include an organic light-emittingdisplay device and a method of manufacturing the same.

Embodiments may be realized by providing an organic light-emittingdisplay device, including a substrate that includes a plurality of firstemission portions that realize a first color and a plurality of secondemission portions that realize a second color; a pixel-defining filmthat defines the plurality of first emission portions and the pluralityof second emission portions; a plurality of pixel electrodes that areseparate from each other and respectively correspond to the plurality offirst emission portions; and a first stacked structure that includes anintermediate layer and a counter electrode on the intermediate layer,the intermediate layer including an organic emission layer emittinglight of the first color, the first stacked structure further includingfirst emission pattern portions respectively corresponding to theplurality of first emission portions, and first connection patternportions on the pixel-defining film, the first connection patternportions connecting the first emission pattern portions.

The first connection pattern portions may be on a portion of a topsurface of the pixel-defining film.

The counter electrode of the first stacked structure may include firstregions that face the pixel electrodes respectively corresponding to theplurality of first emission portions; and a second region that connectsthe first regions.

The intermediate layer of the first stacked structure may include thirdregions that are on the pixel electrodes respectively corresponding tothe plurality of first emission portions; and a fourth region thatconnects the third regions.

The pixel-defining film may include openings corresponding to theplurality of first emission portions, and the third regions may be atlocations respectively corresponding to the openings, and the fourthregion may be on a portion of a top surface of the pixel-defining film.

The intermediate layer of the first stacked structure and the counterelectrode of the first stacked structure may have a substantially samepattern.

The intermediate layer of the first stacked structure may furtherinclude a first intermediate layer that is below the organic emissionlayer in a direction away from the counter electrode, and the organicemission layer may be between the counter electrode and the firstintermediate layer.

The first intermediate layer may include a hole transport layer.

The organic light-emitting display device may further include a secondstacked structure including an intermediate layer and a counterelectrode on the intermediate layer, the intermediate layer of thesecond stacked structure including an organic emission layer emittinglight of the second color. The second stacked structure may furtherinclude second emission pattern portions respectively corresponding tothe plurality of second emission portions, and second connection patternportions on the pixel-defining film, the second connection patternportions connecting the second emission pattern portions.

The second connection pattern portions may be on a portion of a topsurface of the pixel-defining film.

At least one of the first connection pattern portions and at least oneof the second connection pattern portions may overlap each other on theportion of the top surface of the pixel-defining film.

The counter electrode of the second stacked structure may include fifthregions that face the pixel electrodes respectively corresponding to theplurality of second emission portions; and a sixth region that connectsthe fifth regions.

The intermediate layer of the second stacked structure may includeseventh regions that are on the pixel electrodes respectivelycorresponding to the plurality of second emission portions; and aneighth region that connects the seventh regions.

The intermediate layer of the second stacked structure and the counterelectrode of the second stacked structure may have a substantially samepattern.

The organic light-emitting display device may further include aprotection film on the counter electrode of the first stacked structure.

The protection film may have a substantially same pattern as theintermediate layer and the counter electrode of the first stackedstructure.

The counter electrode of the first stacked structure may include asemi-transmissive metal layer, and the protection film may betransparent.

Embodiments may be realized by providing a method of manufacturing anorganic light-emitting display device, the method including preparing asubstrate that includes a plurality of first emission portions thatrealize a first color and a plurality of second emission portions thatrealize a second color; forming a plurality of pixel electrodes havingan island shape so as to separate from each other and respectivelycorrespond to the plurality of first emission portions of the substrate;forming, on the substrate, a pixel-defining film that includes openingscorresponding to the plurality of first emission portions and theplurality of second emission portions; and forming a first stackedstructure that includes an intermediate layer and a counter electrode onthe intermediate layer, the intermediate layer including an organicemission layer emitting light of the first color, the first stackedstructure further including first emission pattern portions respectivelycorresponding to the plurality of first emission portions, and firstconnection pattern portions on the pixel-defining film, the firstconnection pattern portions connecting the first emission patternportions.

The first connection pattern portions of the first stacked structure maybe on a portion of a top surface of the pixel-defining film.

The intermediate layer of the first stacked structure and the counterelectrode of the first stacked structure may have a substantially samepattern.

Forming the first stacked structure may include forming, on thesubstrate, a masking pattern that includes an opening exposing theplurality of first emission portions, and a first non-emission portionconnecting the plurality of first emission portions, the firstnon-emission portion corresponding to a portion of a top surface of thepixel-defining film; forming the intermediate layer including theorganic emission layer emitting the light of the first color, on anentire surface of the substrate on which the masking pattern is formed;forming the counter electrode on the intermediate layer; and removingthe masking pattern such that the first emission pattern portionsrespectively corresponding to the plurality of first emission portionsremain, and the first connection pattern portions that correspond to thefirst non-emission portion and connect the first emission patternportions remain.

The intermediate layer of the first stacked structure may furtherinclude a first intermediate layer that is below the organic emissionlayer in a direction away from the counter electrode, and the organicemission layer may be between the counter electrode and the firstintermediate layer.

The first intermediate layer may include a hole transport layer.

The method may further include forming a second stacked structure thatincludes an intermediate layer and a counter electrode on theintermediate layer, the intermediate layer including an organic emissionlayer emitting light of the second color. The second stacked structuremay further include second emission pattern portions respectivelycorresponding to the plurality of second emission portions, and secondconnection pattern portions on the pixel-defining film, the secondconnection pattern portions connecting the second emission patternportions.

At least one of the second connection pattern portions and at least oneof the first connection pattern portions may overlap each other on aportion of a top surface of the pixel-defining film.

The intermediate layer of the second stacked structure and the counterelectrode of the second stacked structure may have a substantially samepattern.

The method may further include forming a protection film on the counterelectrode of the first stacked structure.

The protection film may have a substantially same pattern as theintermediate layer and the counter electrode of the first stackedstructure.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of skill in the art by describingin detail exemplary embodiments with reference to the attached drawingsin which:

FIG. 1 illustrates a schematic top view of an organic light-emittingdisplay device according to an exemplary embodiment;

FIG. 2 illustrates a cross-sectional view taken along a line A-A′ and aline B-B′ of FIG. 1;

FIG. 3 illustrates a cross-sectional view taken along a line C-C′ ofFIG. 1;

FIG. 4 illustrates a schematic top view of an organic light-emittingdisplay device according to an exemplary embodiment;

FIG. 5 illustrates a schematic side view of a substrate on which aplurality of emission portions are disposed;

FIG. 6 illustrates a top view of FIG. 5;

FIGS. 7 and 8 illustrate cross-sectional views for describing a processof forming a first stacked structure having a first pattern;

FIG. 9 illustrates a top view of FIG. 8;

FIGS. 10 and 11 illustrate cross-sectional views for describing aprocess of forming a second stacked structure having a second pattern;

FIG. 12 illustrates a top view of FIG. 11;

FIGS. 13 and 14 illustrate cross-sectional views for describing aprocess of forming a third stacked structure having a third pattern;

FIG. 15 illustrates a top view of FIG. 14;

FIG. 16 illustrates a schematic cross-sectional view of an organiclight-emitting display device according to an exemplary embodiment; and

FIG. 17 illustrates a schematic cross-sectional view of an organiclight-emitting display device according to an exemplary embodiment.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey exemplary implementations to those skilled in the art.

In drawings, like reference numerals refer to like elements throughoutand overlapping descriptions shall not be repeated.

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items.

It will be understood that although the terms “first”, “second”, etc.,may be used herein to describe various components, these componentsshould not be limited by these terms. These components are only used todistinguish one component from another.

As used herein, the singular forms “a,” “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

It will be further understood that the terms “comprises” and/or“comprising” used herein specify the presence of stated features orcomponents, but do not preclude the presence or addition of one or moreother features or components.

It will be understood that when a layer, region, or component isreferred to as being “formed on,” another layer, region, or component,it can be directly or indirectly formed on the other layer, region, orcomponent. That is, for example, intervening layers, regions, orcomponents may be present.

Sizes of elements in the drawings may be exaggerated for convenience ofexplanation. In other words, since sizes and thicknesses of componentsin the drawings are arbitrarily illustrated for convenience ofexplanation, the following embodiments are not limited thereto.

When a certain embodiment may be implemented differently, a specificprocess order may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

It will be understood that when a component or layer is referred to asbeing “on” another component or layer, the component or layer can bedirectly on another component or layer or intervening component orlayers. Further, it will be understood that when a layer is referred toas being “under” another layer, it can be directly under, and one ormore intervening layers may also be present. In addition, it will alsobe understood that when a layer is referred to as being “between” twolayers, it can be the only layer between the two layers, or one or moreintervening layers may also be present.

FIG. 1 illustrates a schematic top view of an organic light-emittingdisplay device according to an exemplary embodiment.

Referring to FIG. 1, the organic light-emitting display device mayinclude a plurality of emission portions (active areas), i.e., firstthrough third emission portions R1 through R3. The first through thirdemission portions R1 through R3 may be disposed to form a matrix. Thefirst through third emission portions R1 through R3 may each emitdifferent lights and may each correspond to a pixel. For example, eachof the first through third emission portions R1 through R3 may be apixel realizing, e.g., displaying, red, green, or blue. Hereinafter, forconvenience of description, the first emission portion R1 realizes red,the second emission portion R2 realizes green, and the third emissionportion R3 realizes blue, but an exemplary embodiment is not limitedthereto. Colors realized by the first through third emission portions R1through R3 are not limited to red, green, and blue as long as full coloris realized. According to an exemplary embodiment, any combination ofcolors may be used, such as a combination of four colors, i.e., red,green, blue, and white, as long as full color is realized.

Pixel electrodes 210 and first through third stacked structures 300through 500 may be disposed on a substrate 100. The pixel electrodes 210may be patterned in island types to be separated from each othercorrespondingly to the first through third emission portions R1 throughR3. The first through third stacked structures 300 through 500 may bepatterned to have patterns connected to each other, like a net. Thefirst stacked structure 300 may include first emission pattern portions300 a corresponding to the first emission portions R1, and firstconnection pattern portions 300 b connecting the first emission patternportions 300 a, wherein the first emission pattern portions 300 a andthe first connection pattern portions 300 b may form a first pattern S1like a net. The second stacked structure 400 may include second emissionpattern portions 400 a corresponding to the second emission portions R2,and second connection pattern portions 400 b connecting the secondemission pattern portions 400 a, wherein the second emission patternportions 400 a and the second connection pattern portions 400 b may forma second pattern S2 like a net. The third stacked structure 500 mayinclude third emission pattern portions 500 a corresponding to the thirdemission portions R3, and third connection pattern portions 500 bconnecting the third emission pattern portions 500 a, wherein the thirdemission pattern portions 500 a and the third connection patternportions 500 b may form a third pattern S3 like a net.

The first through third stacked structures 300 through 500 may includeintermediate layers 320 through 520 (refer to FIG. 2) and counterelectrodes 330 through 530 (refer to FIG. 2), respectively. Theintermediate layers 320 through 520 and the counter electrodes 330through 530 may be patterned to have substantially the same patterns.

According to a comparative example, when a counter electrode is formedon an entire surface of the substrate 100 to integrally cover aplurality of pixels, i.e., the first through third emission portions R1through R3, a voltage drop (IR drop) may occur, for example, due toresistance of the counter electrode, and luminance deviation may occur.However, according to one or more exemplary embodiments, the counterelectrodes 330 through 530 may be patterned together with theintermediate layers 320 through 520, an increase in the resistance ofthe counter electrodes 330 through 530 may be prevented, and IR drop andconsequent luminance deviation may be reduced or prevented.

FIG. 2 illustrates a cross-sectional view taken along a line A-A′ and aline B-B′ of FIG. 1, and FIG. 3 illustrates a cross-sectional view takenalong a line C-C′ of FIG. 1.

The substrate 100 may be formed of one of various materials, such as aglass material, a metal material, and a plastic material such aspolyethylene terephthalate (PET), polyethylene naphthalate (PEN), orpolyimide. According to some embodiments, the substrate 100 may havehigher flexibility when the substrate 100 is formed of a plasticmaterial or a metal material than when the substrate 100 is formed of aglass material. A buffer layer formed of SiO₂ and/or SiNx may bedisposed on the substrate 100 to prevent impurities from penetratinginto the substrate 100.

The substrate 100 may include a plurality of emission portions (activeareas) R1 through R3, and a non-emission portion (non-active area) NRsurrounding the emission portions R1 through R3.

A pixel circuit PC may include a thin-film transistor (TFT) and acapacitor, and may be electrically connected to the pixel electrode 210.A top surface of the pixel circuit PC may be covered by an insulatingfilm 150 that is approximately flat.

The pixel electrode 210 may be formed in each of the first through thirdemission portions R1 through R3. The pixel electrode 210 may be disposedon the insulating film 150 and may be patterned in an island typecorrespondingly to each of the first through third emission portions R1through R3. The pixel electrode 210 may be electrically connected to theTFT of the pixel circuit PC.

The pixel electrode 210 may be a (semi-)transparent electrode havingtranslucency, or a reflective electrode. When the pixel electrode 210 isa (semi-)transparent electrode, the pixel electrode 210 may be formedof, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zincoxide (ZnO), indium oxide (In₂O₃), indium gallium oxide (IGO), oraluminum zinc oxide (AZO). When the pixel electrode 210 is a reflectiveelectrode, a reflective film may be formed of silver (Ag), magnesium(Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel(Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a compoundthereof. According to an exemplary embodiment, the pixel electrode 210may include a reflective film including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd,Ir, Cr, or a compound thereof, and a film formed of ITO, IZO, ZnO, orIn₂O₃ on the reflective film.

A pixel-defining film 180 may include openings OP respectivelycorresponding to the first through third emission portions R1 throughR3. The openings OP of the pixel-defining film 180 respectively maycorrespond to the first through third emission portions R1 through R3from which lights may be emitted, and a region where the pixel-definingfilm 180 is disposed may correspond to a non-emission portion(non-active area) NR. At least a portion of a top surface of the pixelelectrode 210 may not be covered by the pixel-defining film 180. Forexample, the opening OP may be formed in the pixel-defining film 180,and a portion of the top surface of the pixel electrode 210 may not becovered by the pixel-defining film 180. An edge of the pixel electrode210 may be covered by the pixel-defining film 180. The pixel-definingfilm 180 may include an organic insulating film formed of, for example,acryl resin. The pixel-defining film 180 may increase a distance betweenan end of the pixel electrode 210 and the counter electrodes 330 through530, and an electric arc may be prevented from being generated at theend of the pixel electrode 210.

The first through third stacked structures 300 through 500 may beindependently, for example, separately, patterned. The first throughthird stacked structures 300 through 500 may have structures in whichthe intermediate layers 320 through 520 and the counter electrodes 330through 530 are sequentially stacked, and have the first through thirdpatterns S1 through S3, respectively.

The first stacked structure 300 may have the first pattern S1 includingthe first emission pattern portions 300 a and the first connectionpattern portions 300 b. Each of the first emission pattern portions 300a may be disposed on the first emission portion R1, and the firstconnection pattern portions 300 b may be disposed on the non-emissionportion NR to connect the first emission pattern portions 300 a.

The first stacked structure 300 may include the intermediate layer 320and the counter electrode 330 stacked on the intermediate layer 320, andthe intermediate layer 320 may include a first intermediate layer 321,an organic emission layer 322 emitting a red light, and a secondintermediate layer 323, which are sequentially stacked on each other.

The first intermediate layer 321 may have a single layer or multi-layerstructure. For example, when the first intermediate layer 321 is formedof a high molecular weight material, the first intermediate layer 321may be a hole transport layer (HTL) having a single layer structure andmay be formed of poly-(3,4)-ethylene-dihydroxy thiophene (PEDOT) orpolyaniline (PANT). When the first intermediate layer 321 is formed oflow molecular weight material, the first intermediate layer 321 mayinclude a hole injection layer (HIL) and a HTL.

The organic emission layer 322 may be disposed on the first intermediatelayer 321. According to an exemplary embodiment, the organic emissionlayer 322 may include, as a host material, an anthracene derivative or acarbazole-based compound, and may include, as a dopant material, aphosphor including at least one ofPIQIr(acac)(bis(1-phenylisoquinoline)acetylacetonate iridium),PQIr(acac(bis(1-phenylquinoline)acetylacetonate iridium),PQIr(tris(1-phenylquinoline) iridium), and PtPEP(octaethylporphyrinplatinum). According to an exemplary embodiment, the organic emissionlayer 322 may include a fluorescent material, such as, for example,PED:Eu(DBM)3(Phen) or perylene.

The second intermediate layer 323 may be disposed on the organicemission layer 322. The second intermediate layer 323 may be omitted insome embodiments. For example, when the first intermediate layer 321 andthe organic emission layer 322 are formed of a high molecular weightmaterial, the second intermediate layer 323 may be omitted. When thefirst intermediate layer 321 and the organic emission layer 322 areformed of a low molecular weight material, the second intermediate layer323 may be formed such that light-emitting characteristic is increased.The second intermediate layer 323 may have a single layer or amulti-layer structure, and may include an electron transport layer (ETL)and/or an electron injection layer (EIL).

The counter electrode 330 may be a (semi-)transparent electrode havingtranslucency or a reflective electrode. According to an exemplaryembodiment, when the counter electrode 330 is a (semi-)transparentelectrode, the counter electrode 330 may include a semi-transmissivemetal layer including Ag and Mg. For example, the counter electrode 330may be formed of an Ag—Mg alloy in which an amount of Ag is higher thanan amount of Mg. According to an exemplary embodiment, the counterelectrode 330 may include a layer formed of lithium (Li), calcium (Ca),lithium fluoride (LiF)/Ca, LiF/Al, Al, Mg, or a compound thereof, andanother layer disposed on the layer and formed of a (semi-)transparentmaterial, such as ITO, IZO, ZnO, or In₂O₃.

When the counter electrode 330 is a reflective electrode, the reflectiveelectrode may be formed by forming a layer including, for example, atleast one of Li, Ca, LiF/Ca, LiF/Al, Al, Ag, and Mg. In an embodiment, astructure and material of the counter electrode 330 may vary; forexample, the counter electrode 330 may be formed of another material andmay have a multi-layer structure.

The counter electrode 330 may be patterned to be disposed on the firstemission portions R1 and a part of the non-emission portion NR (forexample, a portion of the top surface of the pixel-defining film 180),resistance may be reduced, and IR drop caused by the resistance of thecounter electrode 330 and consequent luminance deviation may be reducedor prevented.

The first stacked structure 300 may include the intermediate layer 320and the counter electrode 330 disposed on the intermediate layer 320,and the intermediate layer 320 and the counter electrode 330 may havesubstantially the same pattern. For example, the intermediate layer 320and the counter electrode 330 may have the first pattern S1. Forexample, the counter electrode 330 may include regions (hereinafter,referred to as first regions) corresponding to the first emissionpattern portions 300 a and disposed in the first emission portion R1,and a region (hereinafter, referred to as a second region) correspondingto the first connection pattern portion 300 b and disposed on a portionof the top surface of the pixel-defining film 180 to connect the firstregions. The intermediate layer 320 may include regions (hereinafter,referred to as third regions) corresponding to the first emissionpattern portions 300 a and disposed in the first emission portion R1,and a region (hereinafter, referred to as a fourth region) correspondingto the first connection pattern portion 300 b and disposed on a portionof the top surface of the pixel-defining film 180 to connect the thirdregions. The first region of the counter electrode 330 and the thirdregion of the intermediate layer 320 may overlap each other, and thesecond region of the counter electrode 330 and the fourth region of theintermediate layer 320 may overlap each other.

Since the intermediate layer 320 of the first emission pattern portion300 a, i.e., the third region of the intermediate layer 320, is disposedbetween the pixel electrode 210 and the counter electrode 330, when anelectric signal is applied to each of the pixel electrode 210 and thecounter electrode 330, excitons generated as holes and electronsdischarged from the pixel electrode 210 and the counter electrode 330that may combine at the organic emission layer 322 may change from anexcited state to a ground state to generate a red light. Since theintermediate layer 320 of the first connection pattern portion 300 b,i.e., the fourth region of the intermediate layer 320, is disposed onthe pixel-defining film 180 where the pixel electrode 210 is notdisposed, light may not be emitted even when an electric signal isapplied to the counter electrode 330 of the first stacked structure 300.

The second stacked structure 400 may have the second pattern S2including the second emission pattern portions 400 a and the secondconnection pattern portions 400 b. Each of the second emission patternportions 400 a may be disposed on the second emission portion R2, andthe second connection pattern portions 400 b may be disposed on thenon-emission portion NR to connect the second emission pattern portions400 a.

The second stacked structure 400 may include the intermediate layer 420and the counter electrode 430 stacked on the intermediate layer 420, andthe intermediate layer 420 may include a first intermediate layer 421,an organic emission layer 422 emitting a green light, and a secondintermediate layer 423, which are sequentially stacked on each other.

The first intermediate layer 421 may have a single layer or amulti-layer structure. For example, when the first intermediate layer421 is formed of a high molecular weight material, the firstintermediate layer 421 may be an HTL having a single layer structure andformed of PEDOT or PANI. When the first intermediate layer 421 is formedof a low molecular weight material, the first intermediate layer 421 mayinclude an HIL and an HTL.

The organic emission layer 422 may be disposed on the first intermediatelayer 421. According to an exemplary embodiment, the organic emissionlayer 422 may include, as a host material, an anthracene derivative or acarbazole-based compound, and may include, as a dopant material, aphosphor including fac tris(2-phenylpyridine) iridium (Ir(ppy)3).According to an exemplary embodiment, the organic emission layer 422 mayinclude a fluorescent material such as, for example,tris(8-hydroxyquinoline) aluminum (Alq3).

The second intermediate layer 423 may be disposed on the organicemission layer 422. The second intermediate layer 423 may be omitted insome embodiments. For example, when the first intermediate layer 421 andthe organic emission layer 422 are formed of a high molecular weightmaterial, the second intermediate layer 423 may be omitted. When thefirst intermediate layer 421 and the organic emission layer 422 areformed of a low molecular material, the second intermediate layer 423may be formed such that light-emitting characteristic is increased. Thesecond intermediate layer 423 may have a single layer or a multi-layerstructure, and may include an ETL and/or an EIL.

The counter electrode 430 may be a (semi-)transparent electrode havingtranslucency or a reflective electrode. According to an exemplaryembodiment, when the counter electrode 430 is a (semi-)transparentelectrode, the counter electrode 430 may include a semi-transmissivemetal layer including Ag and Mg. For example, the counter electrode 430may be formed of an Ag—Mg alloy in which an amount of Ag is higher thanan amount of Mg. According to an exemplary embodiment, the counterelectrode 430 may include a layer formed of Li, Ca, LiF/Ca, LiF/Al, Al,Mg, or a compound thereof, and another layer disposed on the layer andformed of a (semi-) transparent material, such as ITO, IZO, ZnO, orIn₂O₃.

When the counter electrode 430 is a reflective electrode, the reflectiveelectrode may be formed by forming a layer including, for example, atleast one of Li, Ca, LiF/Ca, LiF/Al, Al, Ag, and Mg. In an embodiment, astructure and material of the counter electrode 430 may vary; forexample, the counter electrode 430 may be formed of another material andmay have a multi-layer structure.

The counter electrode 430 may be patterned to be disposed on the secondemission portions R2 and a part of the non-emission portion NR (forexample, a portion of the top surface of the pixel-defining film 180),resistance may be reduced, and IR drop caused by the resistance of thecounter electrode 430 and consequent luminance deviation may be reducedor prevented.

The second stacked structure 400 may include the intermediate layer 420and the counter electrode 430 disposed on the intermediate layer 420,and the intermediate layer 420 and the counter electrode 430 may havesubstantially the same pattern. For example, the intermediate layer 420and the counter electrode 430 may have the second pattern S2. Forexample, the counter electrode 430 may include regions (hereinafter,referred to as fifth regions) corresponding to the second emissionpattern portions 400 a and disposed in the second emission portion R2,and a region (hereinafter, referred to as a sixth region) correspondingto the second connection pattern portion 400 b and disposed on a portionof the top surface of the pixel-defining film 180 to connect the fifthregions. The intermediate layer 420 may include regions (hereinafter,referred to as seventh regions) corresponding to the second emissionpattern portions 400 a and disposed in the second emission portion R2,and a region (hereinafter, referred to as an eighth region)corresponding to the second connection pattern portion 400 b anddisposed on a portion of the top surface of the pixel-defining film 180to connect the seventh regions. The fifth region of the counterelectrode 430 and the seventh region of the intermediate layer 420 mayoverlap each other, and the sixth region of the counter electrode 430and the eighth region of the intermediate layer 420 may overlap eachother.

Since the intermediate layer 420 of the second emission pattern portion400 a, i.e., the seventh region of the intermediate layer 420, isdisposed between the pixel electrode 210 and the counter electrode 430,when an electric signal is applied to each of the pixel electrode 210and the counter electrode 430, excitons generated as holes and electronsdischarged from the pixel electrode 210 and the counter electrode 430that may combine at the organic emission layer 422 may change from anexcited state to a ground state to generate a green light. Since theintermediate layer 420 of the second connection pattern portion 400 b,i.e., the eighth region of the intermediate layer 420, is disposed onthe pixel-defining film 180 where the pixel electrode 210 is notdisposed, light may not be emitted even when an electric signal isapplied to the counter electrode 430 of the second stacked structure400.

The third stacked structure 500 may have the third pattern S3 includingthe third emission pattern portions 500 a and the third connectionpattern portions 500 b. Each of the third emission pattern portions 500a may be disposed on the third emission portion R3, and the thirdconnection pattern portions 500 b may be disposed on the non-emissionportion NR to connect the third emission pattern portions 500 a.

The third stacked structure 500 may include the intermediate layer 520and the counter electrode 530 stacked on the intermediate layer 520, andthe intermediate layer 520 may include a first intermediate layer 521,an organic emission layer 522 emitting a blue light, and a secondintermediate layer 523, which are sequentially stacked on each other.

The first intermediate layer 521 may have a single layer or amulti-layer structure. For example, when the first intermediate layer521 is formed of a high molecular weight material, the firstintermediate layer 521 may be an HTL having a single layer structure andformed of PEDOT or PANI. When the first intermediate layer 521 is formedof a low molecular weight material, the first intermediate layer 521 mayinclude an HIL and an HTL.

The organic emission layer 522 may be disposed on the first intermediatelayer 521. According to an exemplary embodiment, the organic emissionlayer 522 may include, as a host material, an anthracene derivative or acarbazole-based compound, and may include, as a dopant material, aphosphor including F₂Irpic, (F₂ppy)₂Ir(tmd), or Ir(dfppz)₃. According toan exemplary embodiment, the organic emission layer 522 may include afluorescent material including one of, for example, DPVBi, spiro-DPVBi,spiro-6P, distyrylbenzene (DSB), distyrylarylene (DSA), PFO-basedpolymer, and PPV-based polymer.

The second intermediate layer 523 may be disposed on the organicemission layer 522. The second intermediate layer 523 may be omitted insome embodiments. For example, when the first intermediate layer 521 andthe organic emission layer 522 are formed of a high molecular weightmaterial, the second intermediate layer 523 may be omitted. When thefirst intermediate layer 521 and the organic emission layer 522 areformed of a low molecular material, the second intermediate layer 523may be formed such that light-emitting characteristic is increased. Thesecond intermediate layer 523 may have a single layer or a multi-layerstructure, and may include an ETL and/or an EIL.

The counter electrode 530 may be a (semi-)transparent electrode havingtranslucency or a reflective electrode. According to an exemplaryembodiment, when the counter electrode 530 is a (semi-)transparentelectrode, the counter electrode 530 may include a semi-transmissivemetal layer including Ag and Mg. For example, the counter electrode 430may be formed of an Ag—Mg alloy in which an amount of Ag is higher thanan amount of Mg. According to an exemplary embodiment, the counterelectrode 530 may include a layer formed of Li, Ca, LiF/Ca, LiF/Al, Al,Mg, or a compound thereof, and another layer disposed on the layer andformed of a (semi-) transparent material, such as ITO, IZO, ZnO, orIn₂O₃.

When the counter electrode 530 is a reflective electrode, the reflectiveelectrode may be formed by forming a layer including, for example, atleast one of Li, Ca, LiF/Ca, LiF/Al, Al, Ag, and Mg. In an embodiment, astructure and material of the counter electrode 530 may vary; forexample, the counter electrode 530 may be formed of another material andmay have a multi-layer structure.

The counter electrode 530 may be patterned to be disposed on the thirdemission portions R3 and a part of the non-emission portion NR (forexample, a portion of the top surface of the pixel-defining film 180),resistance may be reduced, and IR drop caused by the resistance of thecounter electrode 530 and consequent luminance deviation may be reducedor prevented.

The third stacked structure 500 may include the intermediate layer 520and the counter electrode 530 disposed on the intermediate layer 520,and the intermediate layer 520 and the counter electrode 530 may havesubstantially the same pattern. For example, the intermediate layer 520and the counter electrode 530 may have the third pattern S3. Forexample, the counter electrode 530 may include regions (hereinafter,referred to as ninth regions) corresponding to the third emissionpattern portions 500 a and disposed in the third emission portion R3,and a region (hereinafter, referred to as a tenth region) correspondingto the third connection pattern portion 500 b and disposed on a portionof the top surface of the pixel-defining film 180 to connect the ninthregions. The intermediate layer 520 may include regions (hereinafter,referred to as eleventh regions) corresponding to the third emissionpattern portions 500 a and disposed in the third emission portion R3,and a region (hereinafter, referred to as a twelfth region)corresponding to the third connection pattern portion 500 b and disposedon a portion of the top surface of the pixel-defining film 180 toconnect the eleventh regions. The ninth region of the counter electrode530 and the eleventh region of the intermediate layer 520 may overlapeach other, and the tenth region of the counter electrode 530 and thetwelfth region of the intermediate layer 520 may overlap each other.

Since the intermediate layer 520 of the third emission pattern portion500 a, i.e., the eleventh region of the intermediate layer 520, isdisposed between the pixel electrode 210 and the counter electrode 530,when an electric signal is applied to each of the pixel electrode 210and the counter electrode 530, excitons generated as holes and electronsdischarged from the pixel electrode 210 and the counter electrode 530that may combine at the organic emission layer 522 may change from anexcited state to a ground state to generate a blue light. Since theintermediate layer 520 of the third connection pattern portion 500 b,i.e., the twelfth region of the intermediate layer 520, is disposed onthe pixel-defining film 180 where the pixel electrode 210 is notdisposed, light may not be emitted even when an electric signal isapplied to the counter electrode 530 of the third stacked structure 500.

Since the first through third stacked structures 300 through 500 may beindependently and separately patterned, at least two connection patternportions may overlap on the non-emission portion NR, i.e., on a portionof the top surface of the pixel-defining film 180. As shown in FIG. 1,the line B-B′ of FIG. 2, and FIG. 3, the first connection patternportion 300 b of the first stacked structure 300 and the thirdconnection pattern portion 500 b of the third stacked structure 500 mayoverlap on the pixel-defining film 180, the second connection patternportion 400 b of the second stacked structure and the third connectionpattern portion 500 b of the third stacked structure 500 may overlap onthe pixel-defining film 180, or the first connection pattern portion 300b of the first stacked structure 300 and the second connection patternportion 400 b of the second stacked structure 400 may overlap on thepixel-defining film 180.

In the current embodiment, two connection pattern portions overlap onthe non-emission portion NR, i.e., on the pixel-defining film 180. In anexemplary embodiment, three connection pattern portions may overlap onthe non-emission portion NR, i.e., on the pixel-defining film 180.

The counter electrodes 330 through 530 of the first through thirdstacked structures 300 through 500 may receive an electric signal bycontacting an external electrode power supply line. According to anexemplary embodiment, electric signals may be individually transmittedto the counter electrodes 330 through 530 of the first through thirdstacked structures 300 through 500. According to an exemplaryembodiment, electric signals may be simultaneously transmitted to thecounter electrodes 330 through 530 of the first through third stackedstructures 300 through 500.

FIG. 4 illustrates a schematic top view of an organic light-emittingdisplay device according to an exemplary embodiment.

In an exemplary embodiment, the organic light-emitting display devicedescribed above with reference to FIGS. 1 through 3 may include thefirst through third emission portions R1 through R3 that emit differentlights and may be arranged in a matrix form.

Referring to FIG. 4, at least one of the first through third emissionportions R1 through R3 may be arranged in a diamond form, or in one ofvarious forms, such as a pentile form.

FIGS. 5 through 15 illustrate views for describing a method ofmanufacturing an organic light-emitting display device, according to anexemplary embodiment.

FIG. 5 illustrates a schematic side view of the substrate 100 on whichthe plurality of emission portions, i.e., the first through thirdemission portions R1 through R3 are disposed, and FIG. 6 illustrates atop view of FIG. 5.

Referring to FIGS. 5 and 6, the pixel circuit PC may be formed on thesubstrate 100. The pixel circuit PC may include the TFT and thecapacitor. Before forming the pixel circuit PC, the buffer layer may beformed on the substrate 100 to prevent impurities from penetrating intothe substrate 100.

The pixel circuit PC may be formed according to the first through thirdemission portions R1 through R3 corresponding to a pixel, and covered bythe insulating film 150 having an approximately flat top surface.

Then, a metal film may be formed on the insulating film 150 and thenpatterned to form the pixel electrode 210 according to the first throughthird emission portions R1 through R3. The pixel electrodes 210 may bepatterned in island types to be separated from each othercorrespondingly to the first through third emission portions R1 throughR3, and a material of the pixel electrode 210 has been described abovewith reference to FIGS. 1 through 3.

An organic insulating film may be formed on the substrate 100 on whichthe pixel electrode 210 is formed, and then patterned to form thepixel-defining film 180. The pixel-defining film 180 may have theopening OP exposing at least a portion of the top surface of the pixelelectrode 210. The openings OP of the pixel-defining film 180respectively may correspond to the first through third emission portionsR1 through R3, and a region where the pixel-defining film 180 isdisposed may correspond to the non-emission portion NR.

FIGS. 7 and 8 illustrate cross-sectional views for describing a processof forming the first stacked structure R1 having the first pattern S1,and FIG. 9 illustrates a top view of FIG. 8.

Referring to FIG. 7, a first masking pattern M1 may be formed to coveran entire surface of the substrate 100 except the first emissionportions R1 and a first region (hereinafter, referred to as a firstnon-emission portion) NR1 of the non-emission portion NR for connectingthe first emission portions R1. A reference numeral O1 of FIG. 7 denotesan opening of the first masking pattern M1, which may expose the firstemission portion R1 and the first non-emission portion NR1. The firstnon-emission portion NR1 may be a region corresponding to the firstconnection pattern portion 300 b of the first stacked structure 300,which may be formed via a lift-off process described later.

The first masking pattern M1 may be formed of a polymer material. In anembodiment, the polymer material should satisfactorily dissolve in asolvent during the lift-off process and barely affect the intermediatelayer 320.

Then, the intermediate layer 320 and the counter electrode 330 may besequentially formed on the substrate 100 on which the first maskingpattern M1 is formed. The intermediate layer 320 may include the firstintermediate layer 321, the organic emission layer 322 realizing red,and the second intermediate layer 323. The first intermediate layer 321,the organic emission layer 322, the second intermediate layer 323, andthe counter electrode 330 have been described above with reference toFIGS. 1 through 3.

According to an exemplary embodiment, a thickness of the first maskingpattern M1 may be thicker than a sum of thicknesses of the intermediatelayer 320 and the counter electrode 330. The intermediate layer 320 andthe counter electrode 330, which may be formed on the first emissionportions R1 and the first non-emission portion NR1 for connecting thefirst emission portions R1, may be discontinuous from the intermediatelayer 320 and the counter electrode 330, which may be formed on thefirst masking pattern M1.

Referring to FIGS. 8 and 9, the first masking pattern M1 may be removedwith the lift-off process. The first stacked structure 300 having thefirst pattern S1 may be formed on the substrate 100 when the firstmasking pattern M1 is removed.

As shown in FIGS. 8 and 9, the first stacked structure 300 may includethe first emission pattern portions 300 a respectively corresponding tothe first emission portions R1, and the first connection patternportions 300 b connecting the first emission pattern portions 300 a,wherein the first emission pattern portions 300 a and the firstconnection pattern portions 300 b form the first pattern S1. The firstemission pattern portion 300 a of the first stacked structure 300 may bedisposed on the pixel electrode 210 that is exposed through the openingOP of the pixel-defining film 180, and the first connection patternportion 300 b of the first stacked structure 300 may be disposed on aportion of the top surface of the pixel-defining film 180.

Since the intermediate layer 320 of the first emission pattern portion300 a is disposed between the pixel electrode 210 and the counterelectrode 330, when an electric signal is applied to each of the pixelelectrode 210 and the counter electrode 330, excitons generated as holesand electrons discharged from the pixel electrode 210 and the counterelectrode 330 that may combine at the organic emission layer 322 maychange from an excited state to a ground state to generate a red light.Since the intermediate layer 320 of the first connection pattern portion300 b is disposed on the pixel-defining film 180 where the pixelelectrode 210 is not disposed, light may not be emitted even when anelectric signal is applied to the counter electrode 330 of the firststacked structure 300.

FIGS. 10 and 11 illustrate cross-sectional views for describing aprocess of forming the second stacked structure 400 having the secondpattern S2, and FIG. 12 illustrates a top view of FIG. 11.

Referring to FIG. 10, a second masking pattern M2 may be formed to coveran entire surface of the substrate 100 except the second emissionportions R2 and a second region (hereinafter, referred to as a secondnon-emission portion) NR2 of the non-emission portion NR for connectingthe second emission portions R2. A reference numeral O2 of FIG. 10denotes an opening of the second masking pattern M2, which may exposethe second emission portion R2 and the second non-emission portion NR2.The second non-emission portion NR2 may be a region corresponding to thesecond connection pattern portion 400 b of the second stacked structure400, which may be formed via a lift-off process described later.

The second masking pattern M2 may be formed of a polymer material. In anembodiment, the polymer material should satisfactorily dissolve in asolvent during the lift-off process and barely affect the intermediatelayer 420.

Then, the intermediate layer 420 and the counter electrode 430 may besequentially formed on the substrate 100 on which the second maskingpattern M2 is formed. The intermediate layer 420 may include the firstintermediate layer 421, the organic emission layer 422 realizing green,and the second intermediate layer 423. The first intermediate layer 421,the organic emission layer 422, the second intermediate layer 423, andthe counter electrode 430 have been described above with reference toFIGS. 1 through 3.

According to an exemplary embodiment, a thickness of the second maskingpattern M2 may be thicker than a sum of thicknesses of the intermediatelayer 420 and the counter electrode 430. The intermediate layer 420 andthe counter electrode 430, which may be formed on the second emissionportions R2 and the second non-emission portion NR2 for connecting thesecond emission portions R2, may be discontinuous from the intermediatelayer 420 and the counter electrode 430, which may be formed on thesecond masking pattern M2.

Referring to FIGS. 11 and 12, the second masking pattern M2 may beremoved with the lift-off process. The second stacked structure 400having the second pattern S2 may be formed on the substrate 100 when thesecond masking pattern M2 is removed.

As shown in FIGS. 11 and 12, the second stacked structure 400 may havethe second pattern S2 including the second emission pattern portions 400a respectively corresponding to the second emission portions R2, and thesecond connection pattern portions 400 b connecting the second emissionpattern portions 400 a. The second emission pattern portion 400 a of thesecond stacked structure 400 may be disposed on the pixel electrode 210that is exposed through the opening OP of the pixel-defining film 180,and the second connection pattern portion 400 b of the second stackedstructure 400 may be disposed on a portion of the top surface of thepixel-defining film 180.

Since the intermediate layer 420 of the second emission pattern portion400 a is disposed between the pixel electrode 210 and the counterelectrode 430, when an electric signal is applied to each of the pixelelectrode 210 and the counter electrode 430, excitons generated as holesand electrons discharged from the pixel electrode 210 and the counterelectrode 430 that may combine at the organic emission layer 422 maychange from an excited state to a ground state to generate a greenlight. Since the intermediate layer 420 of the second connection patternportion 400 b is disposed on the pixel-defining film 180 where the pixelelectrode 210 is not disposed, light may not be emitted even when anelectric signal is applied to the counter electrode 430 of the secondstacked structure 400.

FIGS. 13 and 14 illustrate cross-sectional views for describing aprocess of forming the third stacked structure 500 having the thirdpattern S3, and FIG. 15 illustrates a top view of FIG. 14.

Referring to FIG. 13, a third masking pattern M3 may be formed to coveran entire surface of the substrate 100 except the third emissionportions R3 and a third region (hereinafter, referred to as a thirdnon-emission portion) NR3 of the non-emission portion NR for connectingthe third emission portions R3. A reference numeral O3 of FIG. 13denotes an opening of the third masking pattern M3, which may expose thethird emission portion R3 and the third non-emission portion NR3. Thethird non-emission portion NR3 may be a region corresponding to thethird connection pattern portion 500 b of the third stacked structure500, which may be formed via a lift-off process described later.

The third masking pattern M3 may be formed of a polymer material. In anembodiment, the polymer material should satisfactorily dissolve in asolvent during the lift-off process and barely affect the intermediatelayer 520.

Then, the intermediate layer 520 and the counter electrode 530 may besequentially formed on the substrate 100 on which the third maskingpattern M3 is formed. The intermediate layer 520 may include the firstintermediate layer 521, the organic emission layer 522 realizing blue,and the second intermediate layer 523. The first intermediate layer 521,the organic emission layer 522, the second intermediate layer 523, andthe counter electrode 530 have been described above with reference toFIGS. 1 through 3.

According to an exemplary embodiment, a thickness of the third maskingpattern M3 may be thicker than a sum of thicknesses of the intermediatelayer 520 and the counter electrode 530. The intermediate layer 520 andthe counter electrode 530, which may be formed on the third emissionportions R3 and the third non-emission portion NR3 for connecting thethird emission portions R3, may be discontinuous from the intermediatelayer 520 and the counter electrode 530, which may be formed on thethird masking pattern M3.

Referring to FIGS. 14 and 15, the third masking pattern M3 may beremoved with the lift-off process. The third stacked structure 500having the third pattern S3 may be formed on the substrate 100 when thethird masking pattern M3 is removed.

As shown in FIGS. 14 and 15, the third stacked structure 500 may includethe third emission pattern portions 500 a respectively corresponding tothe third emission portions R3, and the third connection patternportions 500 b connecting the third emission pattern portions 500 a,wherein the third emission pattern portions 500 a and the thirdconnection pattern portions 500 b form the third pattern S3. The thirdemission pattern portion 500 a of the third stacked structure 500 may bedisposed on the pixel electrode 210 that is exposed through the openingOP of the pixel-defining film 180, and the third connection patternportion 500 b of the third stacked structure 500 may be disposed on aportion of the top surface of the pixel-defining film 180.

Since the intermediate layer 520 of the third emission pattern portion500 a is disposed between the pixel electrode 210 and the counterelectrode 530, when an electric signal is applied to each of the pixelelectrode 210 and the counter electrode 530, excitons generated as holesand electrons discharged from the pixel electrode 210 and the counterelectrode 530 that may combine at the organic emission layer 522 maychange from an excited state to a ground state to generate a blue light.Since the intermediate layer 520 of the third connection pattern portion500 b is disposed on the pixel-defining film 180 where the pixelelectrode 210 is not disposed, light may not be emitted even when anelectric signal is applied to the counter electrode 530 of the thirdstacked structure 500.

In an embodiment, the first through third stacked structures 300 through500 may be sequentially formed in FIGS. 5 through 15. Since the firstthrough third stacked structures 300 through 500 may be independently,for example, individually, patterned, a patterning order may be changed.

According to one or more exemplary embodiments, the intermediate layers320 through 520 and the counter electrodes 330 through 530 of the firstthrough third stacked structures 300 through 500 may be patternedtogether, and separate processes for patterning the counter electrodes330 through 530 may not be required. Since top surfaces of theintermediate layers 320 through 520 may be patterned while being coveredby the counter electrodes 330 through 530, the top surfaces of theintermediate layers 320 through 520 may be protected by the counterelectrodes 330 through 530, and a possibility of impurities beingdisposed between the intermediate layers 320 through 520 and the counterelectrodes 330 through 530 may be reduced.

FIG. 16 illustrates a schematic cross-sectional view of an organiclight-emitting display device according to an exemplary embodiment.

Referring to FIG. 16, a protection film 600 may be disposed on at leastone of the counter electrodes 330 through 530 of the first through thirdstacked structures 300 through 500. According to some exemplaryembodiments, when the counter electrodes 330 through 530 are a(semi-)transparent electrode including a metal, such as an Ag—Mg alloy,transmissivity may be decreased as the counter electrodes 330 through530 are exposed to oxygen and oxidized, but when the protection film 600is disposed on the counter electrodes 330 through 530, oxidization ofthe counter electrodes 330 through 530 may be prevented.

The protection film 600 may include a conductive material or anonconductive (insulating) material. According to an exemplaryembodiment, when the organic light-emitting display device is atop-emission type, the protection film 600 may include an organicmaterial and/or an inorganic material having transparency. According toan exemplary embodiment, when the organic light-emitting display deviceis a bottom-emission type, the protection film 600 may include an opaquematerial.

While manufacturing the first through third stacked structures 300through 500, the protection film 600 may be patterned together with theintermediate layers 320 through 520 and the counter electrodes 330through 530. The protection film 600 may have substantially the samepattern as the intermediate layers 320 through 520 and the counterelectrodes 330 through 530.

FIG. 17 illustrates a schematic cross-sectional view of an organiclight-emitting display device according to an exemplary embodiment.

Referring to FIG. 17, a protection film 600′ may be disposed on thesubstrate 100 to cover the first through third stacked structures 300through 500. For example, the protection film 600′ may be formed on thesubstrate 100 to integrally cover all of the first through third stackedstructures 300 through 500.

The protection film 600′ may include a conductive material or anonconductive (insulating) material. According to an exemplaryembodiment, when the organic light-emitting display device is atop-emission type, the protection film 600′ may include an organicmaterial and/or an inorganic material having transparency. According toan exemplary embodiment, when the organic light-emitting display deviceis a bottom-emission type, the protection film 600′ may include anopaque material.

The protection film 600′ may be formed via a process separate from thefirst through third stacked structures 300 through 500. For example, theprotection film 600′ may be formed to cover the entire surface of thesubstrate 100 after the first through third stacked structures 300through 500 are formed.

As described above, according to one or more exemplary embodiments, anorganic light-emitting display device in which occurrence of luminancedeviation is suppressed by reducing an IR drop may be provided.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of skill in the art as of thefiling of the present application, features, characteristics, and/orelements described in connection with a particular embodiment may beused singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. An organic light-emitting display device,comprising: a substrate; a plurality of pixel electrodes over thesubstrate, the plurality of pixel electrodes are separated from eachother; a pixel-defining layer having a plurality of openingsrespectively corresponding to the plurality of pixel electrodes; a firstintermediate layer over a first pixel electrode of the plurality ofpixel electrodes, the first intermediate layer including a firstlight-emitting layer; a second intermediate layer over a second pixelelectrode of the plurality of pixel electrodes, the second intermediatelayer including a second light-emitting layer; a first counter electrodeover the first intermediate layer, and a second counter electrode overthe second intermediate layer, wherein a portion of the firstintermediate layer and a portion of the second intermediate layeroverlap each other over an upper surface of the pixel-defining layer,wherein: the first intermediate layer includes a first sub-intermediatelayer between the first pixel electrode and the first light-emittinglayer, and the second intermediate layer includes a secondsub-intermediate layer between the second pixel electrode and the secondlight-emitting layer, and wherein portions of the first sub-intermediatelayer and the second sub-intermediate layer overlap each other in aregion between neighboring pixel electrodes.
 2. The organiclight-emitting display device as claimed in claim 1, further comprisingan insulating layer between the substrate and the pixel-defining layer,wherein a portion of the pixel-defining layer directly contacts an uppersurface of the insulating layer.
 3. The organic light-emitting displaydevice as claimed in claim 2, wherein an overlapping region between theportions of the first and second intermediate layers corresponds to acontact region between the portion of the pixel-defining layer and theupper surface of the insulating layer.
 4. The organic light-emittingdisplay device as claimed in claim 3, wherein each of the first andsecond intermediate layers further includes at least one of a holetransport layer, a hole injection layer, an electron transport layer, oran electron injection layer.
 5. The organic light-emitting displaydevice as claimed in claim 1, wherein: the first intermediate layerincludes a third sub-intermediate layer between the first light-emittinglayer and the first counter electrode, and the second intermediate layerincludes a fourth sub-intermediate layer between the secondlight-emitting layer and the second counter electrode, and whereinportions of the third sub-intermediate layer and the fourthsub-intermediate layer overlap each other in a region betweenneighboring pixel electrodes.
 6. The organic light-emitting displaydevice as claimed in claim 1, further comprising a protection film overthe first and second counter electrodes.
 7. The organic light-emittingdisplay device as claimed in claim 6, wherein the protection filmincludes a transparent material.
 8. The organic light-emitting displaydevice as claimed in claim 6, wherein the protection film includes aconductive material.
 9. An organic light-emitting display device,comprising: a substrate; and a plurality of organic light-emittingdiodes (OLEDs) over the substrate, the plurality of OLEDs including afirst OLED emitting light of a first color and a second OLED emittinglight of a second color, wherein a plurality of pixel electrodes of theplurality of OLEDs are separated each other on the substrate, edges ofthe plurality of pixel electrodes are covered by a pixel-defining layer,and the pixel-defining layer has a plurality of openings respectivelycorresponding to the plurality of pixel electrodes, wherein a firstintermediate layer of the first OLED includes a first portionoverlapping a first pixel electrode of the plurality of pixel electrodesand a second portion extending from the first portion, wherein a secondintermediate layer of the first OLED includes a third portionoverlapping a second pixel electrode of the plurality of pixelelectrodes and a fourth portion extending from the third portion,wherein the second portion and the fourth portion overlap each otherover an upper surface of the pixel-defining layer, wherein each of thefirst and second intermediate layers includes a sub-intermediate layer,the sub-intermediate layer includes at least one of a hole transportlayer, a hole injection layer, an electron transport layer, or anelectron injection layer, and wherein the sub-intermediate layer of thefirst intermediate layer overlaps the sub-intermediate layer of thesecond intermediate layer in a region over the upper surface of thepixel-defining layer.
 10. The organic light-emitting display device asclaimed in claim 9, wherein an overlapping region between the secondportion and the fourth portion corresponds to a region betweenneighboring pixel electrodes.
 11. The organic light-emitting displaydevice as claimed in claim 10, further comprising an insulating layerbetween the substrate and the pixel-defining layer, wherein thepixel-defining layer contacts an upper surface of the insulating layerin the overlapping region.
 12. The organic light-emitting display deviceas claimed in claim 9, wherein: the first and second OLEDs respectivelyincludes a first and second light-emitting layers, and in the region, atleast one of the first and second light-emitting layers is between thesub-intermediate layer of the first intermediate layer overlaps thesub-intermediate layer.
 13. An organic light-emitting display device,comprising: a substrate; a plurality of pixel electrodes over thesubstrate, the plurality of pixel electrodes are separated from eachother; a pixel-defining layer having a plurality of openingsrespectively corresponding to the plurality of pixel electrodes; a firstintermediate stack over a first pixel electrode of the plurality ofpixel electrodes, the first intermediate stack including a firstlight-emitting layer; and a second intermediate stack over a secondpixel electrode of the plurality of pixel electrodes, the secondintermediate stack including a second light-emitting layer; wherein thefirst light-emitting layer and the second light-emitting layer partiallyoverlap each other in a region between neighboring pixel electrodes. 14.The organic light-emitting display device as claimed in claim 13,wherein an overlapping region between the first intermediate stack andthe second intermediate stack does not overlap the pixel electrodes. 15.The organic light-emitting display device as claimed in claim 13,wherein an overlapping region between the first intermediate stack andthe second intermediate stack is located over an upper surface of thepixel-defining layer.
 16. The organic light-emitting display device asclaimed in claim 13, further comprises a first counter electrode overthe first intermediate stack, and a second counter electrode over thesecond intermediate stack.
 17. The organic light-emitting display deviceas claimed in claim 13, wherein the first intermediate stack furthercomprises a first sub-intermediate layer, and the second intermediatestack further comprises a second sub-intermediate layer.
 18. The organiclight-emitting display device as claimed in claim 17, wherein each ofthe first sub-intermediate layer and the second sub-intermediate layercomprises at least one of a hole transport layer, a hole injectionlayer, an electron transport layer, or an electron injection layer.